Author: Anna
Difference between hot and cold plating
Hot dip and cold dip are two common metal surface treatment processes which are widely used in industrial production, mainly for improving the corrosion resistance, aesthetics and wear resistance of metals. Although both processes involve the application of metal plating, there are significant differences in process principles, operating conditions, and application areas. The following is a detailed description of hot plating and cold plating and how to differentiate between them:
Hot-dip galvanizing, is a metal plating process carried out under high temperature conditions. In the hot plating process, the plated parts are immersed in a bath of molten metal, and the metal forms a metallurgical bond with the base metal at high temperature, resulting in the formation of a solid metal coating.
I. Characteristics of hot dip galvanizing:
1. High temperature operation: hot plating is usually carried out at high temperatures, the temperature of the molten metal is usually between a few hundred and a few thousand degrees Celsius.
2. Metallurgical bonding: due to the high temperature effect, the plating and the substrate can form a good metallurgical bond between the plating and the base metal, making the plating and the base metal is very strong.
3. Thickness of the layer: Hot-dip plating can obtain thicker layers, usually in the range of tens to hundreds of microns.
4. Range of application: Hot-dip plating is suitable for all kinds of metal substrates, especially for steel and iron structural parts that require strong corrosion and wear resistance.
5. Environmental impact: hot plating process may produce a certain degree of environmental pollution, need to take appropriate environmental protection measures.
Cold plating, also known as electroplating, is a metal plating process carried out at room temperature. In cold plating, a metal or alloy coating is deposited on the surface of the base metal through an electrochemical reaction. Cold plating does not involve a high-temperature melting process, but rather current-driven reductive deposition of metal ions.
II. Characteristics of Cold Plating:
1. Room temperature operation: cold plating is carried out at room temperature, no high temperature equipment is needed, and energy consumption is low.
2. Non-metallurgical bonding: cold plating formed between the plating layer and the substrate is a mechanical or chemical bonding, the bonding force is relatively weak.
3. Plating thickness: cold plating can obtain a thin layer, usually between a few microns and tens of microns.
4. Range of application: Cold plating is suitable for a wide range of metallic and non-metallic substrates, especially for small parts that require good appearance and specific properties.
5. Environmental impact: The cold plating process may generate wastewater and exhaust gases containing heavy metals, requiring strict environmental management.